He aha ke kukui LED? No laila he aha kona mau ʻano? ʻO ke kumu nui o ka hana ʻana i nā chip LED ʻo ia ka hana ʻana i nā electrodes contact haʻahaʻa haʻahaʻa haʻahaʻa a hilinaʻi, a no ka hoʻokō ʻana i ka hāʻule liʻiliʻi liʻiliʻi ma waena o nā mea hiki ke hoʻopili ʻia a hāʻawi i nā pads kaomi no nā uea soldering, ʻoiai e hoʻonui ana i ka nui o ka puka māmā. Hoʻohana maʻamau ke kaʻina hana kiʻiʻoniʻoni keʻa i ke ʻano hoʻoheheʻe ʻana. Ma lalo o kahi mānoanoa kiʻekiʻe o 4Pa, hoʻoheheʻe ʻia ka mea e ka hoʻomehana kū'ē a i ʻole ke ʻano hoʻomehana electron beam bombardment, a hoʻololi ʻia ʻo BZX79C18 i mahu metala a waiho ʻia ma ka ʻili o ka mea semiconductor ma lalo o ke kaomi haʻahaʻa.
ʻO nā metala pili P-type maʻamau i hoʻohana ʻia me nā ʻāpana e like me AuBe a me AuZn, ʻoiai ʻo ka metala pili ma ka ʻaoʻao N i hana pinepine ʻia me ka huila AuGeNi. ʻO ka ʻāpana hao i hoʻokumu ʻia ma hope o ka uhi ʻia ʻana pono e hōʻike ʻia e like me ka mea hiki i ka luminescent wahi ma o ke kaʻina photolithography, i hiki i ke koena o ke koena ke hoʻokō i nā koi o nā electrodes pili haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa a me nā pads solder wire pressure. Ma hope o ka pau ʻana o ke kaʻina hana photolithography, pono nō hoʻi e hele i ke kaʻina hana alloying, i hana mau ʻia ma lalo o ka pale o H2 a i ʻole N2. Hoʻoholo pinepine ʻia ka manawa a me ka mahana o ka alloying e nā mea e like me nā ʻano o nā mea semiconductor a me ke ʻano o ka umu ahi. ʻOiaʻiʻo, inā ʻoi aku ka paʻakikī o nā kaʻina electrode ʻulaʻula-ʻōmaʻomaʻo a me nā mea ʻē aʻe, pono ia e hoʻohui i ka ulu ʻana o ka kiʻiʻoniʻoni passivation, nā kaʻina etching plasma, etc.
I ka manufacturing kaʻina o LED chips, i kaʻina hana i koʻikoʻi ka hopena i ko lakou optoelectronic hana?
Ma ka ʻōlelo maʻamau, ma hope o ka pau ʻana o ka hana epitaxial LED, ua hoʻopau ʻia kāna hana uila nui, a ʻaʻole hoʻololi ka hana chip i kona ʻano hana kumu. Eia nō naʻe, ʻo nā kūlana kūpono ʻole i ka wā o ka uhi ʻana a me ke kaʻina hana hoʻohui i hiki ke hōʻemi i kekahi mau ʻāpana uila. No ka laʻana, hiki i ka haʻahaʻa haʻahaʻa haʻahaʻa a i ʻole ke kiʻekiʻe o ka hoʻopili ʻana i ka Ohmic contact, ʻo ia ke kumu nui o ka hāʻule ʻana o ka volta kiʻekiʻe i mua o VF i ka hana ʻana i ka chip. Ma hope o ka ʻoki ʻana, hiki i kekahi mau kaʻina hana corrosion ma nā ʻaoʻao o ka chip ke kōkua i ka hoʻomaikaʻi ʻana i ka leaka hope o ka chip. No ka mea, ma hope o ka ʻoki ʻana me ka maka huila wili daimana, nui nā ʻōpala a me ka pauka ma ka lihi o ka chip. Inā pili kēia mau ʻāpana i ka hui PN o ka puʻupuʻu LED, e hana lākou i ka leaka uila a me ka haki. Eia kekahi, inā ʻaʻole ʻili maʻemaʻe ka photoresist ma ka ʻili o ka chip, e hoʻopilikia ia i ka soldering mua a me ka soldering virtual. Inā aia ma ke kua, e hoʻohaʻahaʻa pū kekahi i ke kaomi kiʻekiʻe. I ka wā o ke kaʻina hana chip, hiki ke hoʻohana ʻia ka hoʻoulu ʻana o ka ʻili a me nā hana trapezoidal e hoʻonui i ka māmā.
No ke aha e hoʻokaʻawale ʻia ai nā ʻāpana LED i nā nui like ʻole? He aha ka hopena o ka nui i ka hana optoelectronic LED?
Hiki ke hoʻokaʻawale ʻia nā pahu kukui LED i nā ʻāpana mana haʻahaʻa, nā ʻāpana mana waena, a me nā pahu mana kiʻekiʻe e pili ana i ka mana. E like me nā koi o ka mea kūʻai aku, hiki ke hoʻokaʻawale ʻia i nā ʻāpana e like me ka pae pae hoʻokahi, pae kikohoʻe, pae dot matrix, a me nā kukui hoʻonaninani. No ka nui kiko'ī o ka chip, pili ia i ka pae hana maoli o nā mea hana chip like ʻole a ʻaʻohe koi kikoʻī. I ka hala ʻana o ke kaʻina hana, hiki i ka chip ke hoʻonui i ka huahana a hoʻemi i nā kumukūʻai, a ʻaʻole e hoʻololi ʻia ka hana photoelectric. ʻO ke ʻano i hoʻohana ʻia e kahi chip pili maoli i ka nui o kēia manawa e kahe ana ma ka chip. Hoʻohana liʻiliʻi ka puʻupuʻu liʻiliʻi i kēia manawa, ʻoiai ke hoʻohana nei ka chip nui i nā mea hou aʻe, a ʻo kā lākou ʻāpana o kēia manawa like ke ʻano like. Ke noʻonoʻo nei ʻo ka hoʻopau ʻana i ka wela ka pilikia nui ma lalo o ke au kiʻekiʻe, ʻoi aku ka haʻahaʻa o kona māmā māmā ma mua o ka haʻahaʻa haʻahaʻa. Ma ka ʻaoʻao ʻē aʻe, i ka piʻi ʻana o ka ʻāpana, e emi ana ke kūpaʻa o ke kino o ka chip, e hopena i ka emi ʻana o ka volta conduction mua.

He aha ka ʻāpana ākea o nā ʻāpana mana kiʻekiʻe LED? No ke aha mai?
ʻIke ʻia nā pahu mana kiʻekiʻe LED i hoʻohana ʻia no ke kukui keʻokeʻo ma ka mākeke ma kahi o 40mil, a ʻo ka mana i hoʻohana ʻia no nā pahu mana kiʻekiʻe e pili ana i ka mana uila ma luna o 1W. Ma muli o ka nui o ka maikaʻi ma lalo o 20%, ua hoʻololi ʻia ka nui o ka ikehu uila i ka ikehu wela, no laila he mea nui ka hoʻokuʻu ʻana i ka wela no nā ʻāpana mana kiʻekiʻe, e koi ana iā lākou e loaʻa kahi wahi nui.
He aha nā koi ʻokoʻa no ka ʻenehana chip a me nā lako hana no ka hana ʻana i nā mea epitaxial GaN i hoʻohālikelike ʻia me GaP, GaAs, a me InGaAlP? No ke aha mai?
Hoʻohana ʻia nā ʻāpana o nā ʻāpana ʻulaʻula a me ka melemele LED maʻamau a me nā ʻāpana ʻulaʻula quaternary kiʻekiʻe a me ka melemele e hoʻohana i nā mea semiconductor compound e like me GaP a me GaAs, a hiki ke hana maʻamau i nā substrates N-type. Ke hoʻohana nei i ka hana pulu no ka photolithography, a ma hope e ʻoki ʻia i loko o nā ʻāpana me ka hoʻohana ʻana i nā lau huila wili daimana. Hoʻohana ʻia ka pāpaʻi polū-ʻōmaʻomaʻo i hana ʻia me ka mea GaN i kahi substrate sapphire. Ma muli o ke ʻano insulating o ka substrate sapphire, ʻaʻole hiki ke hoʻohana ʻia ma ke ʻano he electrode LED. No laila, pono e hana ʻia nā electrodes ʻelua P / N ma ka ʻili epitaxial e ka etching maloʻo a pono e hana ʻia kekahi mau kaʻina passivation. Ma muli o ka paʻakikī o ka sapphire, he paʻakikī ke ʻoki ʻia i loko o nā ʻāpana me nā lau huila wili daimana. ʻOi aku ka paʻakikī o kāna hana hana ma mua o nā mea GaP a me GaAs noNā kukui uila.

He aha ke ʻano a me nā hiʻohiʻona o kahi chip "transparent electrode"?
ʻO ka mea i kapa ʻia ʻo transparent electrode e hiki ke alakaʻi i ka uila a hiki ke hoʻouna i ka mālamalama. Hoʻohana nui ʻia kēia mea i nā kaʻina hana kristal wai, a ʻo kona inoa ʻo indium tin oxide, i hoʻopau ʻia ʻo ITO, akā ʻaʻole hiki ke hoʻohana ʻia ma ke ʻano he solder pad. I ka hana ʻana, pono e hoʻomākaukau mua i kahi electrode ohmic ma ka ʻili o ka chip, a laila e uhi i ka ʻili me kahi papa o ITO, a laila e waiho i kahi papa o nā pad solder ma ka ʻili ITO. Ma kēia ʻano, hoʻokaʻawale ʻia ke ʻano e iho mai ana mai ka uea alakaʻi ma waena o ka papa ITO i kēlā me kēia ohmic contact electrode. I ka manawa like, ma muli o ka helu refractive o ITO ma waena o ka ea a me ka refractive index o ka mea epitaxial, hiki ke hoʻonui ʻia ka huina kukui, a hiki ke hoʻonui ʻia ka flux māmā.

He aha ka hoʻomohala nui o ka ʻenehana chip no ke kukui semiconductor?
Me ka hoʻomohala ʻana o ka ʻenehana semiconductor LED, hoʻonui ʻia kāna noi ma ke kahua o ke kukui, ʻoi aku ka nui o ka puka ʻana o ke kukui keʻokeʻo, ua lilo ia i kumuhana wela i nā kukui semiconductor. Eia nō naʻe, pono e hoʻomaikaʻi ʻia nā kīkī kī a me nā ʻenehana hoʻopili, a ʻo ka hoʻomohala ʻana o nā chips e pono ke nānā aku i ka mana kiʻekiʻe, kiʻekiʻe o ka māmā māmā, a me ka hōʻemi ʻana i ka pale wela. ʻO ka hoʻonui ʻana i ka mana ʻo ia ka hoʻonui ʻana i ka hoʻohana ʻana i kēia manawa o ka chip, a ʻo ke ala pololei ʻoi aku ka hoʻonui ʻana i ka nui o ka chip. ʻO nā pahu mana kiʻekiʻe i hoʻohana mau ʻia ma kahi o 1mm x 1mm, me kahi manawa hoʻohana o 350mA. Ma muli o ka piʻi ʻana o ka hoʻohana ʻana i kēia manawa, ua lilo ka wela wela i pilikia koʻikoʻi. I kēia manawa, ua hoʻoponopono maoli ke ʻano o ka chip inversion i kēia pilikia. Me ka hoʻomohala ʻana o ka ʻenehana LED, e kū ana kāna noi i ke kahua kukui i nā manawa kūpono ʻole a me nā pilikia.
He aha ke ʻano o ka chip inverted? He aha kona hale a he aha kona mau pono?
Hoʻohana maʻamau nā kukui ʻulaʻula ʻulaʻula i nā substrates Al2O3, nona ka paʻakikī kiʻekiʻe, ka haʻahaʻa haʻahaʻa haʻahaʻa, a me ka conductivity uila. Inā hoʻohana ʻia kahi hoʻolālā maʻamau, ma kekahi ʻaoʻao, e lawe mai ia i nā pilikia anti-static, a ma ka ʻaoʻao ʻē aʻe, e lilo ka wela wela i pilikia nui ma lalo o nā kūlana kiʻekiʻe. I ka manawa like, ma muli o ka electrode maikaʻi e kū ana i luna, e ālai ia i kekahi o ka mālamalama a hoʻemi i ka pono luminous. Hiki i nā LED kukui polū mana kiʻekiʻe ke hoʻokō i ka puka māmā ʻoi aku ka maikaʻi ma o ka ʻenehana chip flip ma mua o nā ʻenehana hoʻopili kuʻuna.
ʻO ke ʻano o ka hoʻololi ʻana i kēia manawa, ʻo ia ka hoʻomākaukau mua ʻana i nā ʻāpana kukui polū nui me nā electrodes kuʻihao eutectic kūpono, a ma ka manawa like, e hoʻomākaukau i kahi substrate silika i ʻoi aku ka nui ma mua o ka chip LED kukui polū, a ma luna o ia mea, e hana i kahi. papa alakaʻi gula no ka wiliwili eutectic a me kahi papa alakaʻi (ultrasonic gold wire ball solder joint). A laila, kūʻai pū ʻia nā pahu kukui ʻulaʻula kiʻekiʻe me nā substrates silika me ka hoʻohana ʻana i nā mea hoʻoheheʻe eutectic.
ʻO ke ʻano o kēia ʻano ʻo ia ka pili pono ʻana o ka papa epitaxial i ka substrate silicon, a ʻoi aku ka haʻahaʻa o ke kūpaʻa wela o ka substrate silicon ma mua o ka substrate sapphire, no laila ua hoʻoponopono maikaʻi ʻia ka pilikia o ka hoʻokuʻu ʻana i ka wela. Ma muli o ke kū ʻana o ka substrate sapphire i luna ma hope o ka hoʻohuli ʻana, e lilo ana i mea hoʻoheheʻe ʻia, ʻike ʻia ka sapphire, pēlā e hoʻonā ai i ka pilikia o ka hoʻokuʻu ʻana i ka mālamalama. ʻO ka mea i luna nei ka ʻike pili o ka ʻenehana LED. Manaʻo wau me ka ulu ʻana o ka ʻepekema a me ka ʻenehana,Nā kukui LEDe lilo i mea ʻoi aku ka maikaʻi i ka wā e hiki mai ana, a e hoʻomaikaʻi maikaʻi ʻia ko lākou ola lawelawe, e lawe mai iā mākou i ka ʻoluʻolu.